Integrations

It reads your fab. It does not replace it.

Waferira connects to the SECS/GEM tool integration, APC, inspection, metrology, FDC, yield-management, MES and AMHS systems already in a front-end fab and normalises their signals into one time-aligned wafer and lot record. Recipe writes go back through SECS/GEM, bounded to the qualified window.

Check your stack See the platform

10 system categoriesReads and bounded writesConfirmed per site

run_7b2e9c · agent graph · module M2 · scenario 10 nodes · 1 approval gate
01 · orchestrator ingest.lot ✓ SUCCEEDED 02 · fabtwin twin.simulate ✓ SUCCEEDED 03 · litho_overlay litho.correctables ✓ SUCCEEDED 04 · etch_depo etch.uniformity ✓ SUCCEEDED 05 · cmp_implant cmp.removal ✓ SUCCEEDED 06 · defect_inspect inspect.classify ✓ SUCCEEDED 07 · metrology_vm vm.score ✓ SUCCEEDED 08 · orchestrator approve.human ◆ APPROVAL 09 · yield_dispatch dispatch.route ✓ SUCCEEDED 10 · quality_conf lot.release ✓ SUCCEEDED

Illustrative scenario: Module M2 · 300 mm · metal-1 · lot L-48213, one lot through metal-1, one approval gate

Integrations

It speaks SECS/GEM, not cloud

Waferira reads and writes through the systems already in the fab. No rip and replace, no parallel historian, no new HMI to learn. Vendor names are examples of systems found in front-end fabs; connector availability is confirmed per site.

Tool integration

SECS/GEM on scanners, etchers, deposition, CMP, implanters, furnaces and wet benches

Recipe reads and bounded recipe writes

APC and run-to-run

Advanced and run-to-run process control systems (Applied Materials APF and APC, PDF Solutions, in-house IDM APC)

Model state, correctables, control limits

Defect inspection

Inline optical, e-beam and SEM inspection and review tools (KLA, Applied Materials, Hitachi High-Tech, Onto Innovation class systems)

Images, defect maps, ADC classes

Metrology

Overlay, CD, film and OCD metrology (KLA, Onto Innovation, Nova class systems)

Sampled measurements that ground virtual metrology

FDC and tool sensors

Fault-detection and tool-sensor streams per chamber

Per-wafer signatures for virtual metrology and prognostics

Yield management

Yield and defect analytics (PDF Solutions Exensio, Synopsys, Siemens Camline, INFICON class systems)

Yield, bin and genealogy context

MES and scheduling

Fab MES and schedulers (Applied SmartFactory, Siemens Camstar, Critical Manufacturing, INFICON FPS class systems)

Lots, routes, WIP, dispatch lists

AMHS

Stockers, vehicles and FOUP handling (Daifuku class AMHS)

Carrier moves and handling exceptions

Stores

Tenant-isolated time-series store for tool, metrology and yield telemetry; pgvector for defect images and recipe retrieval

Backfill, replay, retrieval

Fab edge

GPU inference nodes and Jetson at the tool, on-prem control plane option

Inference where the IP lives

See all integrations

Compatibility

Systems and what we do with them

Vendor names are examples of the systems found in front-end fabs, not certified integrations. Connector availability is confirmed during the shadow-mode phase of a pilot.

Systems and what Waferira does with them
CategoryExamples in the fabWhat Waferira does
Tool integrationSECS/GEM on scanners, etchers, deposition, CMP, implanters, furnaces and wet benchesRecipe reads and bounded recipe writes
APC and run-to-runAdvanced and run-to-run process control systems (Applied Materials APF and APC, PDF Solutions, in-house IDM APC)Model state, correctables, control limits
Defect inspectionInline optical, e-beam and SEM inspection and review tools (KLA, Applied Materials, Hitachi High-Tech, Onto Innovation class systems)Images, defect maps, ADC classes
MetrologyOverlay, CD, film and OCD metrology (KLA, Onto Innovation, Nova class systems)Sampled measurements that ground virtual metrology
FDC and tool sensorsFault-detection and tool-sensor streams per chamberPer-wafer signatures for virtual metrology and prognostics
Yield managementYield and defect analytics (PDF Solutions Exensio, Synopsys, Siemens Camline, INFICON class systems)Yield, bin and genealogy context
MES and schedulingFab MES and schedulers (Applied SmartFactory, Siemens Camstar, Critical Manufacturing, INFICON FPS class systems)Lots, routes, WIP, dispatch lists
AMHSStockers, vehicles and FOUP handling (Daifuku class AMHS)Carrier moves and handling exceptions
StoresTenant-isolated time-series store for tool, metrology and yield telemetry; pgvector for defect images and recipe retrievalBackfill, replay, retrieval
Fab edgeGPU inference nodes and Jetson at the tool, on-prem control plane optionInference where the IP lives
Connection

How a module gets connected

The shadow-mode phase of a pilot.

  1. Inventory. List the tools, APC, inspection, metrology, FDC and MES systems on the wedge module, with their interfaces and the security review each needs.
  2. Read-only first. Connect every source read-only inside the fab and build the time-aligned wafer and lot record. No writes exist yet.
  3. Baseline. Measure the agreed yield, excursion, cycle-time and engineer-load metrics from the fab's own records for the baseline period.
  4. Declare the windows. Agree the qualified recipe windows, per-parameter limits, tool-state checks and approvers before any write is enabled.
  5. Assist, then bounded. Writes begin on approval, then inside the window, as the autonomy level is raised.
Boundaries

What Waferira deliberately does not do

Scope limits in version one.

  • Replace the tool controller, the APC system, the MES or the safety interlocks. Waferira is a supervisory layer on top of them.
  • Write any recipe parameter that is not declared, or outside its qualified window.
  • Run full multi-module autonomy across the entire fab in version one.
  • Build long-tail tool integrations beyond the design partners' stacks before they are needed.
  • Move recipes, device designs or process models across tenants.
Run timeline · scenario

One scenario run, step by step

Every Waferira run is an ordered, inspectable sequence. This is run_7b2e9c on Module M2 · 300 mm · metal-1 · lot L-48213. Scenario completes in 10 steps with one approval gate. Overlay and CD predicted inside spec, one reticle-repeater signature caught and held for review, dispatch re-optimised, lot released with full genealogy.

run_7b2e9c Module M2 · 300 mm · metal-1 · lot L-48213 illustrative scenario SUCCEEDED
  1. 01 ingest.lot SUCCEEDED 0.7 s

    Fab Orchestrator · Pulled lot L-48213 from fab MES: 25 wafers, 300 mm, metal-1 layer, route, reticle, overlay and CD spec and the standing cycle-time target. Locked the target envelope for the run.

  2. 02 twin.simulate SUCCEEDED 38 s

    Fab Twin · Simulated 64 candidate correctable, recipe and dispatch sets on the as-run fab twin and ranked them on predicted overlay residual, CD uniformity, excursion risk and cycle time.

  3. 03 litho.correctables SUCCEEDED 1 m 20 s

    Litho-and-Overlay · Per-field overlay correctables and a focus-dose trim written to scanner SCN-07 over SECS/GEM after the previous lot's residual trended toward the control limit. Predicted overlay residual back inside spec.

  4. 04 etch.uniformity SUCCEEDED 58 s

    Etch-and-Depo · Chamber B on etcher ETCH-12 showed an edge-fast uniformity drift in FDC. Pressure and RF trims written within the qualified recipe window; predicted CD uniformity recovered.

  5. 05 cmp.removal SUCCEEDED 46 s

    CMP-and-Implant · Downforce and platen-speed trim on CMP-03 against the virtual removal-rate estimate to hold post-CMP thickness and dishing inside the window.

  6. 06 inspect.classify SUCCEEDED continuous

    Defect-and-Inspect · Inline optical, e-beam review and SEM imagery fused at the tool edge. 1,412 events classified, most dispositioned nuisance; one reticle-repeater signature on three dies flagged for review.

  7. 07 vm.score SUCCEEDED 2.1 s

    Metrology-and-Virtual · Virtual metrology scored every wafer at post-etch and post-CMP from tool-sensor and FDC signatures. Two wafers routed to physical metrology on predicted variance; the rest sampled at plan.

  8. 08 approve.human APPROVAL 1 m 04 s

    Fab Orchestrator · The reticle-repeater signature called for a reticle inspection hold and a recipe move outside the qualified window. Held for the module process engineer and approved at 03:14:27.

  9. 09 dispatch.route SUCCEEDED 4.3 s

    Yield-and-Dispatch · Dispatch re-optimised across 1,840 lots in WIP under reticle, chamber and qualification constraints. The lot routed to the qualified chamber with the shortest predicted queue; AMHS move issued to the stocker.

  10. 10 lot.release SUCCEEDED 1 m 05 s

    Quality-and-Conformance · Lot L-48213 moved on: genealogy written (recipe moves, correctables, FDC signatures, VM scores, defect map, approvals) and checked against the layer spec.

Tool calls · scenario

The agent shows its work

Every tool invocation, argument and result is written to an append-only, IP-isolated, human-readable log, and every reasoning step is expandable. Nothing about a run is hidden from the fab.

tool-call stream · run_7b2e9c
  1. 03:02:10mes.read_lot({ lot: "L-48213", layer: "M1", module: "M2" })
  2. 03:02:11ok 25 wafers · reticle R-M1-114 · overlay and CD spec locked
  3. 03:02:11twin.simulate({ candidates: 64, horizon: "lot" })
  4. 03:02:49ok best set #41 · overlay residual 2.6 nm · excursion risk 0.05
  5. 03:02:50policy.evaluate({ set: 41, autonomy: "L3" })
  6. 03:02:50ok 7 recipe writes inside qualified window · 1 move requires human approval
  7. 03:02:51secs.write_recipe({ tool: "SCN-07", correctables: "per_field", dose: "-0.3%" })
  8. 03:04:11ok predicted overlay residual 3.1 → 2.6 nm · CD on target
  9. 03:04:12secs.write_recipe({ tool: "ETCH-12", chamber: "B", pressure: "+1.5%", rf: "-0.8%" })
  10. 03:05:10ok edge-fast drift cleared · predicted uniformity inside window
  11. 03:05:11secs.write_recipe({ tool: "CMP-03", downforce: "-2%", platen: "+1%" })
  12. 03:05:57ok virtual removal rate on target · dishing inside window
  13. 03:05:58vision.stream({ tools: ["INS-02", "EB-01", "SEM-04"] })
  14. 03:09:40repeater: 3 dies · same field position · reticle R-M1-114 · killer class
  15. 03:09:41vm.predict({ lot: "L-48213", steps: ["post_etch", "post_cmp"] })
  16. 03:09:43ok 25 wafers scored · 2 routed to physical metrology
  17. 03:09:44approval.request({ action: "reticle_hold", recipe_move: "outside_window" })
  18. 03:14:27ok approved by module process engineer · OCAP linked · logged
  19. 03:14:28cuopt.dispatch({ wip: 1840, constraints: ["reticle", "chamber", "qual"] })
  20. 03:14:32ok lot routed to ETCH-12/B · AMHS move to stocker ST-14
  21. 03:14:33amhs.move({ foup: "F-20911", to: "ST-14" })
  22. 03:15:21ok carrier delivered · handling exceptions 0
  23. 03:15:22mes.log_lot({ lot: "L-48213", genealogy: "full" })
  24. 03:16:27ok scenario complete · 10 steps · 1 hold reviewed · released

Reasoning trace

Plan, thought, action, observation, exactly as the orchestrator would record it.

GoalRun lot L-48213 through metal-1 on module M2, hold overlay and…

Run lot L-48213 through metal-1 on module M2, hold overlay and CD inside the layer spec, catch any excursion before physical metrology, and dispatch on cycle-time target.

PlanSimulate the lot on the twin first. Lead with litho so the cor…

Simulate the lot on the twin first. Lead with litho so the correctables are right before etch, then trim etch and CMP against virtual metrology, keep inspection continuous, and hold anything outside the qualified window for a human.

ThoughtThe previous lot's overlay residual on SCN-07 trended toward t…

The previous lot's overlay residual on SCN-07 trended toward the control limit. On the twin, a per-field correctable update with a small dose trim brings the predicted residual back to 2.6 nm without touching focus.

Actiontwin.simulate(candidates=64) returns set #41: per-field correc…

twin.simulate(candidates=64) returns set #41: per-field correctables and dose minus 0.3% on SCN-07, chamber B pressure and RF trims on ETCH-12, downforce minus 2% on CMP-03.

ObservationSet #41 predicts overlay residual 2.6 nm, CD uniformity inside…

Set #41 predicts overlay residual 2.6 nm, CD uniformity inside window and excursion risk 0.05. Nine candidates cut cycle time further but routed the lot to an unqualified chamber and were discarded.

ActionExecute set #41 under autonomy level L3: seven recipe writes i…

Execute set #41 under autonomy level L3: seven recipe writes inside the qualified window, the reticle hold and the out-of-window move routed to the module process engineer.

ObservationReticle-repeater signature on three dies at 03:09:40 from the …

Reticle-repeater signature on three dies at 03:09:40 from the fused inspection stream. Virtual metrology routed two wafers to physical measurement on predicted variance.

OutcomeScenario complete. Overlay and CD predicted inside spec, the r…

Scenario complete. Overlay and CD predicted inside spec, the repeater held and reviewed with the OCAP linked, the lot dispatched to a qualified chamber and released with full genealogy.

Accelerated computing

Physical AI, at the tool

Computational lithography, defect classification on e-beam and SEM imagery, per-wafer virtual metrology and a full-fab twin are among the most compute-intensive workloads in manufacturing. Waferira keeps IP-sensitive inference and feature storage at the fab edge and runs training, simulation and optimisation on GPUs the fab controls.

Metropolis · DeepStream · Holoscan · TensorRT

Inspection vision

Inline optical, e-beam and SEM imagery and sensor fusion on fab-edge GPUs. 10 to 50 inspection streams per pilot module and sub-200 ms priority defect triage are the design targets.

CUDA · RAPIDS · Triton

Virtual metrology and FDC

High-volume multivariate tool-sensor and FDC time-series scoring on every wafer, 1 to 5 seconds per lot-step in the design, with nightly retraining as recipes and chambers drift.

DGX or HGX · CUDA · cuDNN

Training

Defect, virtual-metrology and process-response models retrained per process family; 500 to 2,000 GPU-hours per family per quarter is the design target. Dedicated capacity is planned.

Omniverse · OVX

Fab twin

As-run process and flow simulation, 1,000 to 10,000 candidate recipe, metrology and dispatch scenarios per fab per day in the design. OVX access is planned.

Cosmos · Omniverse Replicator

Synthetic rare events

Rare defect, particle, overlay-drift, CMP-dishing and film-uniformity variants generated and validated against real distributions before promotion. Planned.

cuOpt · RAPIDS

Dispatch optimisation

Constrained WIP dispatch re-optimised every 1 to 5 minutes across reticle, chamber, route, tool-state and cycle-time constraints.

Jetson Orin · Isaac · TensorRT

AMHS and handling

Local FOUP and robot perception and exception detection at the fab edge. Jetson Thor is planned for higher sensor density.

NIM · NeMo · Retriever · Guardrails · AI Enterprise

Process reasoning

Tenant-isolated process Q&A and OCAP reasoning over recipes, SEMI procedures and audit logs, with citations enforced on every answer.

Guardrails

An agent that can move a recipe needs a leash

Waferira writes to production tools over SECS/GEM. Every capability is scoped to a qualified recipe window, every write is policy-checked against tool state, and every action is written to an append-only, IP-isolated audit log the fab owns.

  • Recipe bounds. Each agent writes only inside the qualified recipe window for that tool, with explicit per-parameter limits.
  • Policy and tool-state checks before every write. Autonomy level, tool state, qualification, interlocks and shift are evaluated before a recipe moves.
  • Human-in-the-loop gates. Holds, out-of-window moves and lot release wait for a named approver, with OCAP linkage on every excursion.
  • Immutable, IP-isolated audit log. Append-only and exportable. Every action records source signals, retrieved procedures with citations, predicted impact, allowed range, rollback condition, approver and lot scope.
  • Rollback. Declared rollback conditions return a recipe to its previous qualified version; loss of the edge node leaves the tool on its own controller and recipe.
  • Tenant and IP isolation. Recipes, device designs, defect libraries and process memory never cross a customer boundary. Inference and feature storage stay at the fab edge; an on-prem control plane is available for IP-sensitive fabs.

Compliance posture

ItemScopeStatus
SOC 2 Type I and fab-security reviewControl plane QUEUED Planned, first 6 months
SOC 2 Type IIControl plane QUEUED Planned, 6 to 12 months
SSO and RBACConsole and approvals QUEUED Planned, 6 to 12 months
IP-isolation and security assurance packageFab security and IT and OT review QUEUED Planned, 6 to 12 months
SEMI-standards-cited reasoningRecipes, integration specs, OCAPs RUNNING In the design, every answer cites its source
Per-tenant IP isolationData, models, memory RUNNING In the design from day one
On-prem and fab-edge deploymentIP-sensitive fabs RUNNING Design option

Read the security overview

FAQ

Straight answers

The questions fab directors and process engineers ask in the first meeting.

Yes, over SECS/GEM, but only inside the qualified recipe window for that tool, with per-parameter limits and tool-state checks, and only at the autonomy level your fab has set. Level 1 is advisory: Waferira recommends and an engineer enters everything. Design partners start there, in shadow mode.

Get started

Check your stack

Start with one process module or tool fleet and one measurable baseline. A paid, IP-isolated pilot on defect classification, virtual-metrology-driven overlay and CD control or uniformity APC shows the number before you commit further.

Book a module review See pricing